Technologies

NOVATEC developments cover a very broad spectrum of the electronic industry. Our patented applications are in the following areas :

  • Pasty products printing
  • Liquid products printing
  • Selective printing
  • PCB reworking
  • BGA's and CSP's balling
  • Solder paste reflowing
  • Electronic assembly processes

ProFlex

ProFlex

Stencil technology to improve solder paste release

Vacunest

Vacunest

Flexible board support system, with shape memory

Varidot/Pumprint

Varidot

Chip bonding printing stencils
Patent EP770006 - US6183839 - FR2765813

ProFlow

ProFlow

Solderpaste printing technology
Patent US6495199 - US6171399

DBIC

DBIC

Daughter Board with Integrated Connector
Patent EP1155603 - FR2789541

DirEKt Ball Placement

DirEKt Ball Placement

Patent FR2798309

Spider Printer

Spider Printer

Selective printer
Patent FR2771674 - US6450091 - EP1015247

Prooftag

Prooftag

Universal security marker

Solder Ball Assembly

Solder Ball Assembly

Surface Mount Solder Ball Assembly
Patent US6533160

Hole Filling

Hole Filling

Patent FR2803227

Liquid Printing

Liquid Printing

An evolution of the ProFlow to print liquids
Patent FR2782945

Durashield Filler

Durashield Filler

Thick copper intertracks filling technology

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